Ib tsab xov xwm kom nkag siab txog cov txheej txheem tooj liab immersion
Copper deposition yog ib qho autocatalytic redox cov tshuaj tiv thaiv uas tuaj yeem tso rau ntawm cov khoom siv tsis zoo. Lub luag hauj lwm ntawm immersed tooj liab yog kom paub lub qhov metallization, thiaj li hais tias ob-sided thiab multi-txheej boards yuav paub interconnection ntawm txheej. Copper immersion yog tsim rau electroless tooj liab immersion ntawm cov hlau ntawm cov ntawv luam tawm Circuit Board qhov. Nws kuj yog tsim rau electroless tooj liab immersion nyob rau saum npoo ntawm hlau, hlau, stainless hlau, zinc alloy thiab tooj liab alloy. Nws kuj yog tsim rau ceramic tooj liab plating, iav tooj liab plating, resin tooj liab plating thiab yas tooj liab plating. , pob zeb diamond tooj liab plating, nplooj tooj liab plating, thiab lwm yam.
Copper deposition txheej txheem khoom: desmear, tooj liab deposition (PTH) thiab vaj huam sib luag fais fab (PP) peb-hauv-ib tsis siv neeg ntau lawm kab.
Kev tiv thaiv kev nyab xeeb rau cov txheej txheem tooj liab immersion:
1. Thaum ntxiv potions, koj yuav tsum hnav cov hnab looj tes roj hmab uas tiv taus cov kua qaub thiab alkali, roj qhov ncauj qhov ntswg, lub ntsej muag tiv thaiv, tiv thaiv lub ntsej muag, khau ua haujlwm uas tiv taus cov kua qaub thiab alkali, ua haujlwm aprons thiab lwm yam khoom siv tiv thaiv kev ua haujlwm.
2. Cov kua dej tshuaj lom neeg yuav tsum tau kho raws li qhov yuav tsum tau siv thiab rov siv dua yuav tsum tau rov ua dua tshiab kom siv tag nrho cov peev txheej txuas dua tshiab thiab ua tau raws li cov qauv kev tawm hauv lub tebchaws.
3. Cov huab cua ntawm sunken tooj liab kos duab muaj NO, NO2, HCHO thiab lwm yam tshuaj lom thiab tshuaj lom. Cov neeg ua haujlwm hauv chav ua haujlwm yuav tsum hnav cov khoom siv tiv thaiv kev ua haujlwm sib xws, thiab cov pa hauv chav ua haujlwm yuav tsum tau qhib rau txhua hnub.
4. Nco ntsoov xyuas seb cov kua theem ntawm cov tshuaj puas zoo li qub (raws li cov kua theem qhia hauv lub tank).
5. Nco ntsoov ua tib zoo saib seb qhov ntsuas kub ntawm lub vaj huam sib luag tswj thiab lub twj tso kua mis lim yog qhov qub.
6. Ua ntej pib lub dab ntxuav tes tooj liab txhua zaus, thawj lub tog raj kheej yuav tsum pib los ntawm kev ua cov laug cam. Yog tias cov laug cam tau ua rau lub sijhawm ntev, lub dummy board rub lub tog raj kheej yuav tsum tau ua ua ntej thaum cov khoom rov pib dua.
7. Lub tog raj kheej tooj liab yuav tsum tau inflated ntau zaus, thiab txhua lub tog raj kheej kua tshuaj yuav tsum tau ceev kom huv si kom tsis txhob muaj plua plav thiab lwm yam paug.
8. Ua tib zoo saib xyuas cov teeb pom kev rov qab thaum lub sijhawm tsim khoom, thiab tshuaj xyuas thiab kho tam sim yog pom tias lub teeb pom kev tsis zoo.
9. Nquag xyuas seb lub viav vias, tsis siv neeg dosing, rov tsim dua tshiab, hluav taws kub nyuj, thiab lwm yam.
Cov kauj ruam ntawm cov txheej txheem tooj liab immersion: suav nrog cov kauj ruam hauv qab no
1. Kev kho mob ua ntej tooj liab tog;
2. Kev kho mob ua kom muaj zog;
3. Tshuaj tooj liab deposition.
Kev kho mob ua ntej tooj liab immersion nyob rau hauv cov txheej txheem tooj liab immersion:
1. Deburring: Lub substrate mus dhau txheej txheem drilling ua ntej tooj liab deposition. Txawm hais tias cov txheej txheem no yooj yim los tsim cov burrs, nws yog qhov tseem ceeb tshaj plaws zais kev phom sij uas ua rau lub qhov tsis zoo ntawm qhov metallization. Deburring txheej txheem yuav tsum tau siv los daws nws. Cov txheej txheem tshuab feem ntau yog siv los xyuas kom meej tias tsis muaj barbs lossis blockages ntawm lub qhov npoo thiab cov phab ntsa hauv lub qhov.
2. Tshem tawm cov roj stains:
(1) Qhov chaw ntawm cov roj paug: cov roj paug tawm los ntawm kev sib chwv nrog lub laum me ntsis, cov ntiv tes thaum tshem cov substrate, thiab lwm yam.
(2) Hom roj paug: tsiaj thiab zaub roj, minerals, thiab lwm yam. Lub qub belongs rau saponified roj; lub tom kawg belongs rau cov roj uas tsis yog-saponified.
(3) Cov yam ntxwv ntawm cov roj thiab cov rog: Tsiaj thiab zaub roj yog saponified roj uas nws lub ntsiab yog fatty acids, uas reacts nrog alkali los tsim fatty acid ntsev thiab glycerin uas yog soluble nyob rau hauv dej; Cov qauv tshuaj ntawm cov roj ntxhia yog cov tshuaj paraffin hydrocarbons. Kev sib xyaw ntawm olefins thiab naphthenic hydrocarbons thiab chlorides. Nws yog insoluble hauv dej thiab tsis hnov mob nrog alkali.
(4) Lub hauv paus rau kev xaiv cov roj tshem tawm txoj kev kho mob: raws li qhov xwm txheej ntawm cov roj thiab qib ntawm cov roj paug.
(5) Txoj kev: Siv cov kuab tshuaj organic thiab tshuaj lom neeg thiab electrochemical alkaline tshem tawm roj.
(6) Kev ua haujlwm thiab lub hauv paus ntsiab lus: □ Saponizable roj react chemically nrog alkali tsim fatty acid ntsev thiab glycerin uas yooj yim soluble hauv dej. Cov tshuaj tiv thaiv mis yog raws li nram no:
(C17H35COO)3NAOH3C17H35COONa+C2H5(OH)2
□ Tsis yog-saponified roj: feem ntau yog cia siab rau surfactants xws li OP emulsifier, sodium dodecyl sulfate, sodium silicate, thiab lwm yam. Muaj ob pawg nyob rau hauv cov qauv ntawm cov tshuaj, ib tug yog hydrophobic thiab lwm yam yog hydrophilic. Ua ntej, cov emulsifier yog adsorbed ntawm qhov sib cuam tshuam ntawm cov roj thiab dej, siv cov pab pawg hydrophobic los tsim kom muaj kev sib raug zoo nrog cov roj stains rau saum npoo ntawm matrix, thaum cov pab pawg hydrophilic taw tes rau cov kua roj tshem tawm. Dej yog ib qho muaj zog heev polar molecule, ua rau cov roj stains rau lub gravitational quab yuam nrog lub substrate nto yog txo, thiab los ntawm lub convection thiab stirring ntawm cov roj tshem tawm cov kua, cov roj stains tawm ntawm lub substrate nto, ua kom tiav lub hom phiaj ntawm cov roj tshem tawm.
3. Coarse kev kho mob:
(1) Lub hom phiaj ntawm roughening: feem ntau yog ua kom muaj kev sib raug zoo ntawm cov hlau txheej thiab cov substrate.
(2) Lub hauv paus ntsiab lus ntawm roughening: Ua micro-concave pits rau ntawm qhov chaw ntawm lub substrate kom nws qhov chaw sib chwv, tsim ib lub pob khawm ua ke nrog cov txheej tooj liab, thiab tau txais kev sib txuas ntau dua.
(3) Coarse txoj kev thiab kev xaiv: Nws muaj cov hauv qab no txoj kev, uas feem ntau ua si lub luag hauj lwm ntawm acid etching thiab muaj zog oxidation.
Ammonium persulfate-sodium persulfate-tooj liab chloride tov hydrogen peroxide / sulfuric acid.
Activation kev kho ntawm tooj liab immersion txheej txheem:
1. Lub hom phiaj ntawm kev ua kom muaj zog: feem ntau yog tsim ib qho "pib chaw" ua kom tooj liab deposition uniform.
2. Lub hauv paus ntsiab lus ntawm kev ua kom muaj zog: tso ib txheej txheej ntawm qhov chaw ua kom muaj zog ntawm cov hlau tsis yog hlau yuav tsum tau plated
3. Cov txheej txheem qhib thiab xaiv:
Step-by-step activation method: Nws tau raug pov thawj los ntawm kev xyaum ntau lawm tias colloidal palladium (ib-kauj ruam ua kom txoj kev) muaj kev ua kom zoo heev, ua rau cov txheej tau muab tso rau muaj kev sib raug zoo zog thiab siv sij hawm ntev, tab sis cov kev npaj yog nruj heev. . Qhov kev daws teeb meem yog lub teeb xim av xim.
A. Muaj peb hom colloidal palladium: acidic colloidal palladium, puag palladium, thiab alkaline colloidal palladium.
B. Kev npaj ntawm colloidal palladium: Dissolve 1 gram ntawm palladium dichloride nyob rau hauv 100 ml ntawm hydrochloric acid thiab 200 ml ntawm aqueous tov. Tom qab tag nrho cov yaj, muab lub beaker tso rau hauv ib lub da dej kub tas li kom tswj tau 30 degree ± 1 degree thiab do nyob rau hauv cov xwm txheej Tom ntej, ntxiv 2.54 grams ntawm tin dichloride (SnCl2·2H2O) thiab hnov mob rau 12 feeb, ces sib tov ob txoj kev daws teeb meem ( A, B) (cov khoom xyaw ntawm cov tshuaj B yog 75 grams / liter ntawm tin dichloride thiab 7 grams / liter ntawm sodium silverate NaSnO447H2O, hydrochloric acid 200 ml / L) thiab txuas ntxiv incubate rau 3 teev (them) nyob rau hauv ib tug tas li dej kub. da dej ntawm 40 ~ 50 degree. Lub hauv paus ntsiab lus ntawm kev siv cov txheej txheem no yog tias qhov kev ua haujlwm catalytic ntawm palladium hais txog qhov kub thiab txias. Nws yog paub los ntawm kev xyaum hais tias qhov zoo tshaj plaws tej yam kev mob yog 60 degree ± 5 degree. Ua kom qhov kub thiab txias rau 4-6 teev tsis tuaj yeem txhim kho cov kev ua haujlwm catalytic ntawm palladium hais, tab sis tseem ua rau lawv lub neej ua haujlwm ntev.
C. Kev ua kom muaj zog: Cov qauv micelle ntawm "colloidal palladium" yog ib txheej hluav taws xob ob, thiab [Pd0]m yog cov tub ntxhais colloidal. Thaum lub sijhawm ua haujlwm, Sn2+ yog thawj zaug adsorbed hauv qhov pores, thiab tom qab ntawd cov divalent tin ions yog adsorbed thiab ces C1-1 yog adsorbed, tsim ib [nSn2+·2(nx)Cl -] txheej adsorption thiab tsim ib pawg colloidal. Xws li micelles raug nqi tsis zoo thiab yuav tsis agglomerate thaum sib tsoo nrog cov tshuaj aqueous. Lub 2xCl-1 sab nraum lub adsorption txheej yog ib txheej diffusion.
D. Kev saib xyuas ntawm kev ua kom muaj kev daws teeb meem: Vim tias qhov kev npaj ntawm kev ua kom muaj kev daws teeb meem yog qhov nyuaj thiab raug nqi, thov xyuam xim rau cov ntsiab lus hauv qab no thaum siv nws.
Txhawm rau kom tsis txhob nqa dej mus rau hauv cov tshuaj ua kom muaj zog, kho nws nrog cov tshuaj hauv qab no rau 2 mus rau 3 feeb ua ntej ua kom: SnCl2·2H2O40g / L HCl100ml / L. Cov txheej txheem no hu ua pre-soaking, thiab tom qab ntawd ua kom muaj kev kho mob. Lub hom phiaj yog lim dej. Qhuav.
Lub substrate uas tau noj yuav tsum muaj cov tshuaj me me li sai tau thiab rov qab ntxuav dua hauv lub tank rov qab. Siv cov dej no los ntxiv rau kev noj cov tshuaj ua kom muaj zog lossis npaj cov tshuaj tshiab.
Tom qab siv cov tshuaj activation rau ib lub sij hawm, thaum pom stratification, 10 mus rau 20 grams stannous chloride ib liter yuav muab ntxiv raws li qhov tseeb ntim ntawm cov activation tov, thiab stratification yuav ploj mus.
Thaum qhov ntsuas kub qis dua 15 degree, qhov ua kom muaj zog tsis zoo thiab cua sov yuav tsum tau siv. Yuav tsum muaj lub tsho da dej rau cua sov.
E. Degumming kev kho mob: Tshem tawm cov tshuaj residual activation kom tsis txhob raug coj mus rau hauv lub tank tooj liab thiab ua rau cov tshuaj decompose. NaOH 50 g / L lub sijhawm kho yog 1.5 feeb.
